Optimization of parallel plate heatsinks for forced convection

Cooling of processors in servers, workstations and desktop computers has changed to accommodate increasing power, approaching 100 watts. Dedicated fan-duct-heatsink combinations are becoming state-of-the-art for packaging of the processor(s). Extruded heatsinks, standard for many years, require larger space, pressure drop and/or fan/blower power than necessary. In this study, optimum dimensions of fin thickness and pitch are calculated for a variety of realistic operating conditions. These dimensions are somewhat smaller then those achievable by extruded heatsinks.