High efficiency active cooling system

In this paper we present a new method of active cooling of microstructures. The method consists in controlling the active heat sink in relation to the dissipated power in the microstructure and a thermal model of the package. We intend to design an on-chip controller as an ASIC cell. The cell could be placed on the same silicon substrate together with a requiring cooling structure. A special silicon current sensor was designed to estimate the dissipated power in the structure. Simulation results of the active cooling with a new method are presented as well as a design of current sensor.