Next generation of WLCSP contacting technologies for 250 micron pitch and below

Spring probes are becoming a viable alternative to traditional probe card technologies for contacting Wafer Level Chip Scale Package (WLCSP) devices. Over the past decade, probe head designers have been challenged by several trends in semiconductor packaging. The most notably trend is a narrowing in the WLCSP “pitch” between balls, pumps pillars, and pads along with an increase in operating frequencies and a reduction of operating voltage. This paper explores a new probe architecture that is commercially available. The focus of this paper is a new and unique spring probe technology for WLCSP test.