Highly functionalized EMC package materials for fingerprint sensors

The current trends of chip packaging technologies are moving towards providing the functional solutions for modules, where chips cannot fully perform their roles without the support of functionalized packaging materials. Functionalized EMC specialized for future capacitive fingerprint sensors and further wearable, Fintech, and IoT technologies requires following functions or properties: high dielectric constant (Dk: >21 or28), flexibility (Modulus at 25°C: <; 10Mpa), flow-ability (spiral flow: > 60 inch) and uniformity of appearance (Defection rate by black stains: <;0.02%). Here, we present the state of the art achievements on those functions and properties of functionalized EMC.