Novel CMP pads by special structural design

We provide a serial of chemical mechanical polishing (CMP) pads, which are produced by pre-polymers and multi-components of curing agents. The curing agents containing aromatic diamines and secondary aliphatic polyetheramines are mixed with the pre-polymers to create new CMP pads which has obturator structure by microspheres. Average diameter of the microspheres with smaller size is less than 30 micron, which bring higher remover rate and less defects to the polished wafer. A serial of CMP pads with different hardness are manufactured by the above method for polishing copper processes. By carefully study of the effects of hardness to the polishing performance, we choose appropriate pads for advanced semiconductor manufacturing processes.