Abstract:
In this paper, a new repair scheme which consists of a new repair algorithm and a base die structure of TSV based 3D memory is proposed. The traditional repair process in...Show MoreMetadata
Abstract:
In this paper, a new repair scheme which consists of a new repair algorithm and a base die structure of TSV based 3D memory is proposed. The traditional repair process in 3D memory uses extra cells in each memory layer. This paper proposes a new redundancy cell structure for repairing memory layers using spare cells on the base die which consists of solution memory, spare CAM and a control structure. The experimental results show that the repair rate of the new repair scheme is better than that of the inter-die method.
Published in: 2017 International SoC Design Conference (ISOCC)
Date of Conference: 05-08 November 2017
Date Added to IEEE Xplore: 31 May 2018
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