A new repair scheme for TSV-based 3D memory using base die repair cells | IEEE Conference Publication | IEEE Xplore

A new repair scheme for TSV-based 3D memory using base die repair cells


Abstract:

In this paper, a new repair scheme which consists of a new repair algorithm and a base die structure of TSV based 3D memory is proposed. The traditional repair process in...Show More

Abstract:

In this paper, a new repair scheme which consists of a new repair algorithm and a base die structure of TSV based 3D memory is proposed. The traditional repair process in 3D memory uses extra cells in each memory layer. This paper proposes a new redundancy cell structure for repairing memory layers using spare cells on the base die which consists of solution memory, spare CAM and a control structure. The experimental results show that the repair rate of the new repair scheme is better than that of the inter-die method.
Date of Conference: 05-08 November 2017
Date Added to IEEE Xplore: 31 May 2018
ISBN Information:
Conference Location: Seoul, Korea (South)

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