Reliability challenges in advance packaging

This paper highlights the packaging related reliability issues in various advanced packaging schemes such as 3-D stacking, interposers, fan-out packaging, and the more recently developed silicon interconnect fabric integration. The need for heterogeneous integration, superior electrical and thermal performance, reduction of form factor and overall system-footprint, and integration of high-density interconnects are the main driving forces behind the development of these advanced packaging techniques. As the packaging and system integration is becoming more complex, the emphasis is mainly on improving the reliability of system-level packaging rather than the individually packaged devices.