Four-Channel 784 Gbit/s Transmitter Module Enabled by Photonic Wire Bonding and Silicon-Organic Hybrid Modulators

We demonstrate a four-channel hybrid multi-chip module comprising InP lasers, silicon-organic hybrid (SOH) modulators, and single-mode fibers, all connected via photonic wire bonds. We transmit 56 GBd QPSK and 16QAM signals at a total data rate of 784 Gbit/s over 75 km.