New communication and isolation technology for integrated gate driver IC solutions suitable for IGBT and Si/SiC MOSFETs: Gate drive units, intelligent integrated drivers

New power semiconductors with requirements for high power density need novel gate driver technologies, which fulfill the necessary needs for higher working voltages, temperature and packing requirements that meet international standards for creepage, clearance and isolation coordination. In this paper an innovative communication and isolation technology, integrated in a new industrial package design, is presented. In addition, highly integrated, advanced gate driving functions such as semiconductor protection against overvoltage during a short circuit event is proposed.