Realization of Accurate On-Wafer Measurement Using Precision Probing Technique at Millimeter-Wave Frequency

This paper demonstrates a novel measurement technique that can be utilized in on-wafer calibration and device evaluation procedures. This technique can realize a repeatable determination of the distance between probes thorough RF signal detection. The measured S-parameters are analyzed to determine the origin coordinates of probes. As these procedures are automated, operator dependence in the alignment of the probe position and resolution of the microscope is eliminated. A fully automatic probe station is constructed, and an impedance standard substrate (ISS) with special alignment patterns is fabricated for realizing this technique. The origin coordinates of two probes are determined at a certain position above the alignment patterns. The obtained variation in the distance between the probes is a few micrometers, which is less than that in conventional manual probing. Measurement reproducibility is investigated by evaluating the standard deviations of the measured S-parameters of a matched transmission line on the ISS. The proposed technique exhibits lower standard deviations compared to those of conventional manual probing.