Selective over-molding of a CMOS TSV wafer with the flexible 3D integration of components and sensors

The Wafer Level Packaging (WLP) and the Through Silicon Via (TSV) technology in combination with side by side Multi Chip packaging is miniaturizing the packages in size and height. The packaging and the over-molding of system on wafer for a diversity of sensor packages is an extraordinary challenge. Smart Systems for Indoor and Outdoor or an Wearable wrist watch application have to do environmental monitoring of for example (toxic) gasses like CO, CO2, VOC's, Infrared sensors, Infrared sensors for fire detection, temperature sensors, light sensors, UV-A/B sensors and humidity sensors. This paper will highlight the packaging and over-molding technology of the recent developments of a CMOS TSV wafer with the flexible 3D integration of sensors (57) on a CMOS platform. The Film Assisted Molding in combination with the developed Dynamic Insert Technology creates the solution for selective over-molding of all types of sensor applications on a CMOS platform chip or wafer with 3D-stacked dies. The process flow, assembly, packaging, and over-molding challenges of the Multi Sensor Platform will be discussed. A most suitable approach for the heterogeneous system integration and allows the development and fabrication of miniaturized smart sensor systems with significant advanced technologies.