Development of chip-first and die-up fan-out wafer level packaging

This study is for fan-out wafer-level packaging (FOWLP) with chip-first and die-up processing. The chips with Cu contact pads on the front-side and a die attach film on the backside are picked and placed face-up on a temporary glass carrier with a layer of light-to-heat conversion material. It is followed by compression molding with epoxy molding compound (EMC) and post mold cure (PMC) on the reconstituted wafer carrier, and then backgrinding the molded EMC to expose the Cu contact pads (Cu revealing) of the chips. The next step is to build up the redistribution layers (RDLs) from the contact pads and then mount the solder balls. Next comes the de-bonding of the carrier with a laser, and then the dicing of the whole reconstituted molded wafer into individual packages.