Risk assessment study of new product development

Heterogeneous IC package is increasing its complexity year by year. Combinations of composite materials and ultimate mechanical feature such as thin, small, and light enable launching attractive handheld products to consumer market. By seeing those products, it's really thought that how packaging technologies have contributed to the market. In other words, it can be said that how reliable advanced technologies have adopted into such products. However, some serious quality issues have reported after launching to the market. Once it happens unfortunately, it worsens company image and tremendous recall cost jeopardizes business continuity [1]. Hence, it reminds development engineers that how it's crucial to assess potential quality risks in new product development phase. In other aspects, risk cannot be only considered to quality matters. Finance, resource, schedule, and green environment are imperative items to assess additionally. On this context, risk assessment also raises its importance on multifaceted nature. In this article, it's discussed about a new multifaceted risk assessment(MF-RA) method by utilizing some essences of Hierarchical Holographic Modeling(HMM) and Design Review Based on Failure Mode(DRBFM). This method also intends to reveal tacit knowledge and support pointing out latent potential risks in product design phase.