Evaluation of metal post interconnected parallel plate structure for power electronic building blocks

This paper evaluates metal post interconnected parallel plate structure (MPIPPS) adopted for the power electronic building blocks (PEBB) packaging program in terms of parasitic elements involved in the layout design, current distribution and its impact on electrical performance. It also compares this technology with the more conventional wire-bond technology. Electrical performance predicted by INCA, Maxwell, and PSPICE is verified with an experimental setup.