Three dimensional auto meshing flexibility for SiP package CAE molding simulation

The development of SiP (System in Packaging) product is complicated due to the complexity of different components structures and resin material properties while processing. This process contains the interconnection between diverse electronic components and curing phenomenon of thermoset material, and various control management of process conditions. The CAE technology has provides a more scientific way to help people for solving the problems and enhancing the development. However, when the microchip product is getting more complex, it's not easy for a designer to build up a mesh model for the CAE analysis efficiently. Hence, this study is to develop a true 3D auto meshing technique with flexibility in the CAE technology to evaluate the design of SiP package via CAE molding simulation. Through this technological integration, the auto-meshing technique can simplify the model creation and allow designers to validate designs efficiently. Furthermore, the prediction of resin flow front evolution shows the current integrated approach can obtain the realistic interaction between different components during encapsulation process. By using the integrated analysis, the developed approach surely proved from numerical experiments to be a cost-effective method for the SiP Package CAE Molding Simulation.