Technology options for mm-wave test and measurement equipment

5G and aerospace/defense (A/D) trends are influencing the requirements for mm-wave test and measurement (T&M) equipment and the underlying technologies. Additional requirements such as small formfactors, lower-cost mm-wave test, and connector-less test are emerging. To meet these challenging attributes, both silicon and III-Vs have important roles to play. Si provides attractive solutions for small form-factor & high-volume applications with its excellent integration and economies of scale. However, operating voltages limit performance while high NRE costs create challenges for high-mix low-volume businesses. While III-Vs are well suited to mm-wave performance, they have significantly higher manufacturing costs and require continued advances in packaging to meet form-factor needs. Simultaneously addressing performance and cost needs at mm-wave requires careful consideration of these tradeoffs to drive selection of, and improvements in, semiconductor devices and packaging solutions.