Single TO-can GPON ONU bi-directional optical sub-assembly with Si-Micromechanics

We present a new bidirectional optical subassembly (BOSA) packaging method which utilizes silicon optics and mechanics to integrate a lens, a DFB laser, a monitor photodiode (MPD) and a wavelength division multiplexing (WDM) filter into a silicon submount. The technology enables a compact packaging form within in a single trasnsistor outline can (TO-can) for BOSA. We made most of the assembly process on a designed silicon submount wafer. The wafer scale assembly brings the advantages for handling, burn-in screening and testing in high-volume production. Our results show promising optoelectronic performance for the GPON class B+ optical network unit (ONU). The output optical power is typically above 2mW and the average responsivity above 0.8A/W with the sensitivity above -29dbm is demonstrated. The demonstrated technique provides an alternative way to fabricate of a low-cost and compact size BOSA for various potential applications.