Low order compact model development for LED package thermal investigation

In this paper we present a new computational method for calculating thermal transfer impedances between a few separate locations of a given physical structure aimed at the implementation into a field-solver based on the SUNRED (SUccessive Node REDuction) algorithm. The order reduction was done by the balanced truncation method. We tested the method on a simplified LED package in 3D. Results obtained by the proposed new calculation method and results obtained by the conventional numerical simulation are compared and the error was estimated based on the difference of these results. Based on that comparison we found that the proposed method is fast and accurate.