Plastic encapsulated ICs bonding reliability risk assessment at HT automotive application

ICs bonding reliability at High Temperature (HT) application is considered. Namely results of investigations of bond ball lift failure mode category at post HT stresses Wire Bond Pull (WBP) tests for AlAu intermetallic interface at T_amb>150degC are presented in submitted paper. Simplified model of reliability risk assessment on the base of impact of such input factors as application temperature, life time, kind of wires, bonding parameters settings, and used mold compound is developed.