Analysis of insulated-metal-substrates structures in the context of heat dissipation enhancement

This paper discusses analysis of an insulated-metal-substrates structure of a printed circuit board in terms of the temperature management of p-n junction of LEDs mounted on the structure's surface. The structure material and surface area are used for the heat transfer between the junction and the ambient surroundings. The heat dissipation has been simulated for conductor layer thicknesses in the range from 50μm to 200μm and the dielectric layer thicknesses from 50μm to 150μm. The thermal simulation has been conducted for two base layer materials - aluminum and copper having the same thickness of 920μm. The results of the simulation provide optimum thickness of the structure materials and their thermal conductivity to ensure most efficient heat dissipation.