Ultra-low inductive power module design with integrated common mode noise shielding

A new ultra-low inductive 600 V / 200 A half-bridge power module, called LinkPack module, with integrated DC-link capacitors and common mode EMI shielding was realised. LinkPack module contains intentionally SiC-Mosfets, however it is also possible to equip Si-IGBTs and Si-diodes respectively SiC-diodes. This allows the realisation of full SiC-Mosfets modules, hybrid SiC modules and Si-IGBT / Si-diodes modules. The goal of this research was a significantly improved switching performance by reducing the power loop inductance in order to reduce switching losses and increasing efficiency. Integration of a common mode EMI shielding is a another very important aspect of the module design, which will be topic of this paper. LinkPack modules are intended to be driven at high switching frequencies of 20 kHz and more. Raising the switching frequency causes an increase of common mode noise spectrum level. So an effective EMI shielding is mandatory to avoid additional, large sized common mode filter devices. Measurements revealed an improved switching performance and less switching process oscillations. Turn-off speed is increased by factor 1.6, and simultaneously the common mode noise level can be significantly reduced up to 25 dBμV in a wide frequency range compared to corresponding conventional reference module design.