Simulation techniques for EMC compliant design of automotive IC chips and modules

Automotive electronic units need to comply fully with electromagnetic compatibility (EMC) regulations. This paper proposes a comprehensive simulation methodology and techniques for analyzing EMC performance of integrated circuits (ICs) in chip-package-system (CPS) board integration. Extended chip power models (ECPMs) model automotive ICs for noise emission (EMI) and also for noise susceptibility (EMS), and provide a suite of EMC models that facilitate joint design of EMC compliant systems by semiconductor chip vendors and electronic module integrators. Automotive local interconnect network (LIN)-bus transceivers in a 0.13 μm Bipolar/CMOS/DMOS (BiCD) chip were analyzed under the direct power injection (DPI) method for EMS testing standardized in IEC62132-4. The ECPM derived for the complete LIN integrated circuit by a high-capacity mesh solver provides a passive network that models not only power delivery networks, but also isolation structures in the circuit's silicon substrate. These isolation structures include junction diodes and trench insulators surrounding BiCD devices coupled to the substrate. The chip/package/system simulation including the ECPM of the whole LIN circuit predicts the coupling of noise sinusoids induced by high-power EMS tests and explains the root cause of the susceptibility of LIN circuits, as verified by on-chip measurements in test chips.