Resolution of die chippings thru determination of occur and escape cause at automatic optical inspection process — Wiljelm Carl K. Olalia

At Wafer Level Chip Scale Package, Every Sawn Wafers underwent Automatic Optical Inspection to ensure that all Dice affected by Mechanical Defect specifically Chippings will be screened-out effectively. An average of 151 defect per million of Chippings has been effectively screen-out at AOI process from WW07'15 to WW32'15.