Measurement and correlation of the PCB high speed links

On a PCB, the high-speed link layout design with high component density has to satisfy strict mechanical and electrical specifications. Not only does the design and manufacturing process become difficult, but also the correlation between measurements and simulations is extremely challenging. In this paper, we focus on the above-mentioned challenge encountered in the measurement correlation process which has seldom been addressed in existing literatures for high speed links, especially for those with over 30Gbps signals. We discuss in detail several critical factors that will affect the effectiveness of the simulation and measurement correlation process. All discussions are demonstrated for a 32Gbps system. This work provides a practical reference to general high-speed link development.