Modeling and impedance analysis of power distribution network in 3D ICs with TSVs

This paper focuses on the modeling and analysis of different power distribution network (PDN) structures in 3D TSV ICs, including 3D full wave model and equivalent circuit model. In addition, a simplified equivalent circuit model of stacked PDN is proposed to analysis aspects influencing stacked PDN impedance, such as number of ground TSVs, number of TSV pairs and number of stacked layers. Analyses about how these aspects influencing total capacitance, inductance of stacked PDN and causing resonance in PDN self-impedance (Z₁₁) are made in detail. What's more, power noise in different stacked PDN structures is calculated and analyzed in time domain to evaluate their power integrity features. Analysis in this paper can offer instructions for the design and analysis of on-chip PDN.