A model for 3D-printed microstrip transmission lines using conductive electrifi filament

New research on wearable electronics, domotics, flexible circuits, and RF applications on conformal surfaces have used the advancements of material science and additive manufacturing technology. Parallelly, the limited design specifications of industrially available PCB substrates (i.e., flat substrates) has stimulated a de novo exploration for more complex electronic circuits with versatile geometries. In this paper, the development of a microstrip transmission line using additive manufacturing technology and Electrifi conductive filament is reported for the first time. The simulated and measured transmission properties of the design are also compared and presented.