Design and analysis of circular MPA using multi-layer substrate sandwich for bandwidth enhancement

In this paper, the design of circular microstrip patch antenna with sandwiching the substrates has been proposed for bandwidth enhancement. The proposed antenna is designed at 2.7GHz (S-band) using High Frequency Structural Simulator. The circular patch antenna is designed on two different substrates, FR4_epoxy and RT Duroid 5880™ and fabricated on the three layer FR4-epoxy substrate. The effect of dielectric constant, substrate stacking on the performance of an antenna system is compared and results from the simulator are analyzed. The result analysis shows that the bandwidth of this antenna has increased 2.5 times with three layer stacking at 10 dB return loss and directive gain of 4.7dBi. The work can be enhanced in the future using metamaterials to reduce the antenna weight and to increase the bandwidth of operation.