E-band characterization of 3D-printed dielectrics for fully-printed millimeter-wave wireless system packaging

This work explores the integration of 3D and inkjet printing manufacturing processes with millimeter-wave (mm-wave) wireless packaging technology. Stereolithography-based (SLA) 3D printing methods are discussed for two classes of materials: polymeric and ceramic-loaded dielectrics. 3D-printed materials are characterized for performance within the E-band wireless regime (55-95 GHz), extracting relative permittivity and loss tangent. Thermal cycling tests are performed in order to evaluate the thermal stress characteristics of the printed dielectrics structures. Die encapsulation with SLA printing technology is presented as an alternative to the standard molding and stamping technology. Inkjet printing is used to demonstrate the fabrication of metallic structures directly onto 3D-printed packages, highlighting potential applications of on-package antenna arrays, lenses, and metamaterial surfaces. Finally, inkjet-printed mm-wave transmission lines are realized on 3D-printed ramp structures, demonstrating efficient 3D interconnects with ramp slopes up to 65° for through-mold-via (TMV) solutions.