Dielectric waveguide based multi-mode sub-THz interconnect channel for high data-rate high bandwidth-density planar chip-to-chip communications

This paper presents a dielectric waveguide based multi-mode sub-THz interconnect channel for high data-rate high bandwidth-density planar chip-to-chip communications. By using a proposed new transition of microstrip line to dielectric waveguide, the interconnect channel achieves wide bandwidth on two orthogonal modes E_y11 and E_x11. To the authors' knowledge, this is the first demonstration of a multi-mode sub-THz interconnect channel. The measured minimum insertion losses for mode E_y11 and mode E_x11 are 8.0 dB with 21.3 GHz 3-dB bandwidth and 9.0 dB with 24.0 GHz 3-dB bandwidth, respectively.