Investigation the effect of silane onto fabricating polymer insulation layer by spin-coating for through silicon vias

3D packaging using through silicon via (TSV) technology is becoming important in IC packaging industry. The polymer material as insulation material was fabricated by the spin-coating or spray-coating process. And the polymer insulation can relax some of the stress induced and makes the process more convenient compared with CVD. Therefore, it is the most cost effective technology for the wafer level packaging. In this study, some polymer insulation materials with different silanes are investigated comprehensively, including viscosity thixotropic index, adhesion strength, thermogravimetry analysis, differential scanning calorimetry and conformal coating. All the results show that the silane has significant effect on the adhesion strength and conformal coating. The adhesion strength is improved when the silane with nitrogen atom, and the insulation layer can be spin-coated uniformly or most filled vias when the silane with different polarity are used.