The effect of curing process on laser releasable debonding temporary material for 3D packages

In this paper, UV laser systems with 308 nm was focused. we studied a special release material which showed intense absorption more than 90% on 308 nm laser. And the effect of curing process of laser releasable material was studied. In addition, thermal stability was investigated, showing excellent performance such as the T_5% (temperature of 5% weight loss ) >587°C. Finally, the laser releasable material coating on the supporting wafer was paired with a adhesive material on the device wafer, and after the thinning process, the de-bonding was operated by laser (308 nm) irradiation. The result showed that the wafers were easily separated and the supporting wafer was easily cleaned which could be recycled.