Comparison of Darveaux model and Coffin-Manson model for fatigue life prediction of BGA solder joints

The reliability of interconnections in microelectronic packages is an urge concern for the well-functioned electronic devices. Owing to the mismatch of CTE of different materials involved in the interconnections, the structures endures high risk of fatigue failure under thermal cycle loading. Numerous fatigue life prediction models have been proposed or developed for the evaluation of reliability of interconnections, e.g., solder joints, under thermal cyclic loadings. Particularly, energy-based Darveaux model and strain-based Coffin-Manson model are two widely employed to predict fatigue life for BGA solder balls. In this paper, the fatigue life prediction results of solder balls in BGA packaging using Darveaux model and C-M model have been compared and discussed, varied geometric size have been deployed to further explore the performance of two selected fatigue models. Simulation results show that the predictive life of Darveaux model above the other one. Additionally, in both models, fatigue life increase while the height increase and decrease with the diameter increase, although the trends are slightly different.