Introduction of capacitive fingerprint sensor packaging technology

Fingerprint identification technology has developed rapidly in recent years, widely used in attendance, access control, intelligent devices, especially in smart phones. Fingerprint identification technology is mainly divided into optical fingerprint technology, capacitance fingerprint technology and ultrasonic fingerprint technology. In this paper, the principle and technical features of the three technologies are described. The detailed application of capacitive fingerprinting technology is introduced in detail, and its encapsulation technology is introduced. The principle analysis, solution and effective improvement of the chip surface imprint are carried out.