Investigations on implementing solder alloy free technology for electronics based on printed conductive paste

The paper will present a continuation of our investigation [1] in implementing a solderless assembly process for electronics. The addressed technology is known as the OCCAM process and was patented by Verdant Industries [2]. We present our proof of feasibility, at least for a prototyping phase on a single connection layer. Different from the original process that employs for the interconnection tracks a chemical (electroless) copper metallization, we will use a new conductive paste, especially developed for printed tracks. [3]. Beside the qualitative description of technological steps required to produce the OCCAM module, we will present also some quantitative results on the resistance of tracks printed with this conductive paste.