Wafer-scale encapsulation of fully differential electrodes for mutli-axis inertial sensing

This work demonstrates, for the first time, a wafer-scale encapsulation process incorporating fully circumferential electrodes (in-plane and out-of-plane) for applications towards multi-axis inertial sensing. Bottom and top electrodes were incorporated in the device package utilizing epitaxial silicon deposition. By this method, we present fully differential, vacuum-encapsulated, oxide-coated polysilicon resonators.