Evaluation of high thermal conductivity dielectric on the temperature of PCB components

Cooling of printed circuit board (PCB) components such as voltage regulator MOSFETs and memories has significant effect on GPU performance. Traditionally, FR4 has been used as the dielectric material for PCB which has low thermal conductivity. In this work, the effect of a new high thermal conductivity dielectric material called THIN LAM® on the temperature of PCB components was investigated. THIN LAM® has 10x higher thermal conductivity than FR4. Experimental results on discrete graphics cards show 17% reduction in the thermal resistance for the voltage regulator MOSFETs using a PCB made with the THIN LAM® compared to a PCB made with the FR4.