1.7 kV High-Current SiC Power Module Based on Multi-Level Substrate Concept and Exploiting MOSFET Body Diode during Operation

The paper presents switching performance of a high-current 1.7 kV SiC half-bridge (phase-leg) module based on ABB's new module platform - LinPak. The module is based on a multi-level substrate concept allowing high flexibility in power module design necessary for paralleling of many semiconductor devices. The MOSFET body diode is used as a free-wheeling diode since the module does not contain any SiC Schottky diodes. The module is carefully optimized by electromagnetic and electro-thermal simulations before its assembling and testing.