Gas Chromatography Mass Spectrometry (GC-MS) application in back end semiconductor: Chemical cleaning efficiency assessment

In comparison to GC-MS applications in semiconductor front end (wafer fabrication), this technique seems to have fewer applications in semiconductor back end (package assembly processes assessment. In this work, GC-MS is applied in a different analysis approach for cleaning efficiency assessment in one of the back end processes. This analysis approach is proposed, executed, assessed, improved and finally reported with positive results in the characterization method of cleaning quality using packages from back end processes. A unique sample preparation method is introduced in this assessment to collect solution which is dissolved from the entire external package surfaces and enables GC-MS analysis. Inclusion of reference as standard in this GC-MS analysis approach is crucial to ensure conclusive results of cleaning efficiency assessment.