Experimental and numerical studies of wire vibrations in bonded abrasive wire saw processing

Bonded Abrasive Wire (BAW) saw slicing is a popular method for silicon carbide wafer production; however, the wires are highly susceptible to vibrations. In this paper, a vibration model of the wire saw is presented, and a numerical analysis of this model, which is confirmed by experiments, is developed. The experiments show that the model can predict vibration characteristics of wire saw with no processing or processing and the biggest error of model in frequency domain is 10.6%. Moreover, the wire tension is an important factor for wire saw vibration. The experiments show that a 50% increase in tension may make a 43.2% increase in vibration frequency, and the relationship is not linear depended on tension control device.