Low solids flux technology for solder assembly of circuit packs

The feasibility of using low solids fluxes for circuit pack assembly is investigated. The potential benefits are enormous since the use of these fluxes eliminates the need for post-solder cleaning. The results of the tests have demonstrated a dependence of the surface insulation resistance on the quantity of applied low solids flux. Because of this correlation, a technique was required to apply a minimal amount of flux. Since no commercially available fluxers were suitable, a means of fluxing to address this need was studied and was implemented.<>