New low coefficient of thermal expansion polyimide for inorganic substrates

Recent interest in using polyimides for high-density interconnect applications (HDI) in which multilayer structures are formed has created a need for polyimides that have a coefficient of thermal expansion (CTE) matched to that of the underlying substrate. A polyimide chemistry that allows for a significant lowering of the CTE and subsequent reduction of stress on silicon and ceramic substrates while giving improved dielectric constant