Temporary handling technology by polyimide based adhesive bonding and laser assisted de-bonding

The manuscript gives a general overview of a temporary handling technology suitable for full wafers or single components. The technology is based on thermocompression type wafer bonding using polyimide adhesives and laser assisted de-bonding through glass carrier wafers using a 248 nm excimer laser. Both, bonding and also de-bonding and cleaning approaches are discussed in detail. Special focus is drawn on transmission requirements of the glass support wafer at 248 nm. Wafer of different glass types and from different vendors are compared regarding their transmission properties at this particular wave length. Detailed experiments reveal the required exposure parameters (dose and repetitions) for a successful release of the corresponding glass materials. Additionally to process details and conditions a list of different application scenarios for the presented handling technology are discussed and explained with specific examples.