Detection of defects in ceramic substrate with embedded passive components by scanning acoustic microscopy

Delaminations of the embedded passive components are often associated with reliability problems. Understanding the delamination can help us quickly identify the failure cause at an early stage of the failure analysis. In this work, defects of buried capacitors have been detected by use of scanning acoustic microscopy (SAM). The results show that SAM can be a powerful analytical tool for the nondestructive evaluation of delaminations in buried passive components. T-scan is an effective method for determining the existence of the internal defects, and TAMI-scan is shown to be capable of detecting the location and size of the delamination and void.