Global collaborative electronic packaging education

This is a proposal to establish a global collaborative educational program at the MS level in electronics packaging in the School of Engineering at the Hong Kong University of Science and Technology (HKUST). Packaging and assembly are in transition to become a key factor in deciding the weight, size, durability, performance, and cost of an electronic product. Increasingly the electronic packaging technology determines the productivity and competitiveness of the electronics industry. The goal of this program is to educate skilled engineers, technical managers and visionary leaders who can pull off the transition to the future for the electronics packaging industry. The program will be based in the Mechanical Engineering Department (ME) with course contribution from the Electronics and Electrical Engineering Department (EEE), the Chemical Engineering Department (ChE), the Industry Engineering Department, and IEEE-CMPT. Curricula in this program include traditional engineering core courses and specialized electronic packaging courses. The medium of instruction will be English.