Analysis of Crosstalk Effects for Multiwalled Carbon Nanotube Bundle Interconnects in Ternary Logic and Comparison With Cu Interconnects

In this study, the crosstalk-induced effects are investigated in ternary logic by using the three-line bus architecture. The worst case crosstalk delays for both repeated and unrepeated interconnect and the peak crosstalk noise voltage on the victim net are investigated. Analyses have been done for global level multiwalled carbon nanotube (MWCNT) bundle and copper interconnects with carbon nanotube FET-based drivers and receivers at 22 nm node. According to the HSPICE simulations, the crosstalk delay and noise area in the MWCNT bundle interconnects are much smaller than the Cu wires for the ternary logic. In addition, the MWCNT bundle interconnects require a lower number of repeaters as compared to the Cu wires, which results in lower complexity and power consumption. The results indicate that utilizing the MWCNT interconnects instead of Cu wires in ternary systems leads to 63% shorter crosstalk delay without repeater insertion and 65% lower crosstalk noise area and 75% lower power consumption with repeater insertion. It is concluded from the results that the MWCNT bundle global wires are more suitable for ternary very large scale integration systems as compared to the Cu wires.