Electrical-thermal characterization of carbon nanotube based through glass vias for 3-D integration

Through glass vias (TGVs) is the core technology of three dimensional (3-D) integration. This paper extracts the equivalent electrical parameters of carbon nanotube (CNT) based TGVs and establishes the distributed transmission line model of ground-signal-signal-ground (GSSG) type TGV interconnects. Based on the proposed equivalent circuit model, the effect of various design parameters, such as via pitch, via radius and material properties on the electrical performance of TGV interconnects is evaluated. Due to the domination of conductor loss, it is seen that the electrical characterization of TGV interconnects is totally different from that of conventional through silicon vias (TSVs). Comparison in peak temperature using COMSOL shows that the thermal performance of 3-D integration with glass interposer is significantly improved by replacing copper with CNT in via application.