Manufacturing of sandwich structures for the integration of electronics in in mold labelling components

For the manufacturing of decorative Molded Interconnect Devices, In-Mold Labelling is combined with foils functionalized by printing. This appears to enable a cost efficient process chain, e. g. for automotive interior applications. The presented work gives a brief overview of the full process chain that is investigated. Relevant material parameters of the foil systems and the conductor pastes for printing are discussed. Furthermore, process adaptations required for screen printing and for back-molding are addressed as well as effects of the deformation on the conductivity of the circuit tracks. In addition, the basic interconnection technology for SMD by conductive adhesives is investigated. The results are summarized in the form of a representative 3D demonstrator.