Analysis of PCB embedded power semiconductors for a 30 kW boost PFC converter

Packages of power semiconductors have considerable influence regarding the thermal impedance, the parasitic inductance, which affects the switching losses, and the reliability. In this paper, the performance of a phase leg of a PFC rectifier with PCB embedded power semiconductors is investigated. The mechanical stress in the PCB is analyzed by a FEM simulation and PCB design guidelines are given. The thermal impedance, parasitic inductance and switching losses of a real test setup are measured and compared with commercial modules. Based on this data, an optimization of a PFC rectifier with respect to volume, including the EMI filter, is performed for a converter using PCB embedded power semiconductors and compared to a converter using power semiconductors with conventional packaging. The converter using PCB embedded power semiconductors achieves a 21% lower volume compared to a converter using power semiconductors with conventional packaging.