Silicon modules increase system efficiency

The microsystems technology is a silicon hybride technology developed by Svenska MikroSystem AB. Linkaping. Sweden. in cooperation with the University of Linkoping. as a part of national development program for microsystems design and production. The technology is thin film processes for resistors. capacitors and metal layers on a silicon substrate. which gives the outmost density for interconnections and passive components. The technology is easily adapted to the needs of your system; from a simple single metal layer interconnection to a complex substrate with resistors. capacitors and up to four metal layers. Consequently, it is also possible for the system designer to design high performance R-C-networks on a single chip. This will allow you to choose the most effective price/peffoin a cc solution. since the microsystems technology easily is combined with conventional hybride or circuitboard technology, with respect to complexity. space requirements etc. Furthermore, system quality is increased since them is no thermal mis matching between the silicon substrate and the dices assembled on it. Normally wirebonding is used for the connections. but them am no obstacles for using c. g. flip-chip- or TAB-technique as well. Since a minimum number of packages is obtained, the number of solder connections is heavily reduced. Packaging options am any large-cavity standard package in plastic, ceramic or metal. Also special lead-frames for molded plastic packages are available. Even a module-on-board, i. c. the substrate is directly assembled on a circuitboard and covered with a silica gel globe-top, is a sufficient assembly for many applications. The presentation will also give detailed information on process steps and component performance. Applications for military. automotive and office, where the microsystems technology is used. are presented.