Development of thin film resistor and abrasion protective layer for thermal printing head

A double-layer resistor formed by RF sputtering and an abrasion protective layer formed by the plasma CVD (chemical vapor deposition) method are described. The Si/(Ti-C-Si-O) double layer resistor has high resistivity, low temperature coefficient of resistance (TCR), and high resistance to thermal oxidation. The SiON abrasion protective layer formed by the plasma CVD method using an SiH/sub 4/-N/sub 2/N/sub 2/O gas mixture at temperatures above 350 degrees C has high microhardness, high thermal durability and high productivity. A highly reliable, highly productive, high-resistance thermal printing head was realized using these materials. Its experimentally determined characteristics are reported.<>